Basic Knowledge

DC to AC inverter

• DC to AC inverter Lecture Notes 1 2 3
• Inverter waveshaping by quasi square wave inverters and pulse width modulation
• Breakdown voltage : punch through and non punch through

• Electronics
  • Electric Circuits Video 1  2  3
  • RLC circuit (as in the gate of a transistor, where L is stray inductance, C is gate-source capacitance) 
  • Electronic Circuits
  • Handbook on Power Electronics
  • Text book: Power Electronics 
  • Power Electronics
  • AC Power
  • Three Phase AC Power   1       2
  • AC Drive
  • Hard and soft switching 
  • Power Factor Correction Guide
  • Miller Effect
  • Matrix Converter
  • Electric Symbols 
  • Power Electronics Basic Knowledge in Videos : 1,  2,  3,  4, 5
  • Why diodes are used around relay coils: Back to Basics on flyback or snubber diodes

• • Ultrawide‐Bandgap Semiconductors: Research Opportunities and Challenges [2017.12]

  • gallium oxide as an ultrawide bandgap semiconductor [2018.12]
  • Sheet resistance : Wikipedia      Measuring Sheet Resistance
• Diodes
  • Introduction to diodes
  • PN Junction 
  • Principles of Semiconductor Devices 
  • Depletion region
  • Principles of diodes (good animation) 
  • Capacitance-Voltage Measurement (and defect density determination by CV measurements)
  • Permittivity: it relates to the breakdown voltage of power devices
  • Metal – Semiconductor junction Lecture Notes Depletion region
  • Metal – Semiconductor junction Lecture Notes (UC Berkely)
  • Schottky barrier diodes including barrier lowering by image carriers 
  • Method_of_image_charges (to be used in Schottky barrier lowering )
  • Optimization on metal-semiconductor contacts: CTLM
  • Understanding Diode Reverse Recovery and its
    Effect on Switching Losses (Fairchild whitepaper)
  • Schottky Diodes
  • Zener diodes and Avalence diodes  1   
  • Relationships among breakdown voltage, Ron, bandgap, etc.
  • 10_Optimization & Comparison of Power Devices
  • Characteristics of Si and SiC Fast Recovery Diodes (Rohm)
  • General Diode Terminology (Physical Explanation) 
• MOSFET
  • Lecture Notes on CMOS Processes (Wayne University) 
  • MOSFET Device Physics and Operation (RPI)
  •  MOS Lecture Notes (UC Berkeley)     22      23    22 (pdf)  23(pdf)
  • MOS Lecture Notes UIUC  1     2   pdf1    pdf2 
  • MOSFET subthreshold leakage current      (punch through , drain induced barrier lowering DIBL) 
  • Capacitance-Voltage Measurement 

• • MOS lecture in video Caltech. 104N  105N  108N 109N 110N 111N 112 N 113N 115N 116N   (click here for faster access in Bilibilie.com)
  • MOSFET review (2002 Stanford with a view on the effect of gate scaling down )
  • Power semiconductor devices     (local pdf file)
  • MOSFET
  • Positive and negative temperature coefficients 
  • Threshold voltage of the MOSFET  Video 1
  • Methods to determine the threshold voltage from measured data 
  • Sub-threshold current in MOSFETs  1  2  3  4 5 

  • Coulomb Scattering on Mobility Degradation of Ge pMOSFET by Various PDA Ambiences （CN IME 2021）

  • GATE OXIDE RELIABILITY OF POLY􏰀SI AND POLY􏰀SIGE CMOS DEVICES ( a PhD thesis 2000)

  • A Review Paper on CMOS, SOI and FinFET Technology (2020)

  • MOSFET Circuits  Video 1  2  3  4
  • Fundamentals of MOSFET and IGBT Gate Driver Circuits (TI )
  • MOSFET application using its datasheet (video, YouTube)

  • Parasitic Turn-on of Power MOSFET – How to avoid it?  / miller effect (Infineon )

  • Power MOSFET Basics: Understanding Gate Charge and Miller
    Effect and Using it to Assess Switching Performance (Vishay) 

  • Power MOSFET
  • Power_MOSFET_BasicsThirdQuadrant (1st&3rdQuadrants)
  • Power MOSFET (Infineon)
  • MOSFET Technology Scaling, Leakage Current 
  • The Trench Power MOSFET: Part I—History, Technology, and Prospect (2017.03)
  • Rds(on) with device structures (like channel width, oxide thickness, voltage rating, etc.)    1    2   3(buried channel MOSFET)   4 (Surface-Channel Versus Buried-Channel Devices)
  • Fundamentals of MOSFET and IGBT Gate Driver Circuits (TI, 2017)
  • Thermal measurement of junction temperatures (AOS Power)
  • Thermal design of IGBT modules (ABB)
  • A 3D perspective image of a hexagonal trench MOSFET (HEXFET)

  • A Review Paper on CMOS, SOI and FinFET Technology (2020)

  • N-type buried layer (NBL) influence on ESD of MOSFET (TSMC 2007)
  • How to use MOSFET as a switch
  • MOSFET turning on and off: charges, Miller effect, driver   video 1
  • MOSFET Applications  Video 1
  • RF devices (1) 
  • RF devices (2) 
  • Switching Losses: Effects on Semiconductors
  • Hard switching and soft switching

  • The Hard Facts On Soft Switching

  • Linear Mode Operation and Safe Operating Diagram of Power-MOSFETs (Infineon)
  • Motor Control IGBTs and Free‐Wheeling Diodes (On Semiconductor)
  • Ringing Reduction Techniques for  MOSFETs (TI)
  • Inverter for air conditioners — introduction by Mitsubishi
  • ELECTROMAGNETIC INTERFERENCE & COMPATIBILITY  (EMI) tutorial 2018
  • Transmission Lines : case for high voltage
  • Matlab implementation of EKV3.0 (2006   2007)
  • EKV3.0 modeling of MOSFETs (2002)
  • Accurate MOS Modelling for Analog Circuit Simulation Using the EKV Model (classic model for MOSFET, 1996)
  • EKV Model 
  • Introduction to SiC and GaN devices in power electronics Videos
    • 1 (ASU) 
    • 2 (ASU)
    • 3 (Characterization and applications, Cambridge)
    • 4 (Auburn Univ.)
    • 5 (fabrication, Oxford)
    • 6 (materials and devices, Italy)
    • 7 (PV System configurations)
    • 8 (The Components of PV systems)

• IC Design Basics 

   

  • IC Design & Manufacturing Process _ Beginners Overview to VLSI (Video)

• Basic Processes

  • How_MOCVD_works
  • Nelson rules for process control  
  •  Cleaning
    • SPM cleaning (photoresist stripping, wafer cleaning)   1. pdf  2. link
    • RCA process (before high-temperature processing steps)
    • Wafer Clean and Wet Processing (2012) 
    • Wafer Cleaning Procedures (RPI)
    • N-Methylpyrrolidone (NMP)
    • Carbon Dioxide in Semiconductor Manufacturing (Linde-Gas)
    • Metal contamination in Wafer Fab (1999)
  • Main Differences in Processing Si and SiC Devices ( 2017, Univ. of Warwick, UK)
  • Wet Etching
    • Etching Rates (16 materials, 317 combinations, UC Berkeley 1996)
  • Gate formation
    • Thermal oxidation of Silicon (Wikipedia)

    • Self-aligned Techniques (UC Berkley Lecture Notes, with layouts)

    • Self-aligned gate formation 1 
    • Self-aligned polysilicon gate MOSFET 2 ( a master thesis 2005)
    • Silicides & Metal gate  (Starford 2005)

    • Wet Oxidation 

  •  Metallization
    • Diffusion barrier
      • TiN  1 (2004)
      • TiW
  • Ion Implantation
    • Lecture Notes (UC Berkeley 2010) 
    • Scattering oxide for ion implantation (TU Wien)
  • Planariation
    • Planarization by photoresist and etch back (Boston Univ. 2006)
  • Thin Film
    • LPCVD 1 (amorphous silicon, poly-silicon, silicon dioxide, TEOS, etc. )

Testing/Characterization

Automotive Power Module
Qualification [Europe ECPE AQG 324 Guidance]

• The Double Pulse Test System for Power Semiconductor Dynamic Characterization [KeySight 2019]
• Double Pulse Test: Principle and Application to SiC diodes and MOSFETs
• Double Pulse Test videos: KeySight Tektronix Nexperia
• Cree double pulse test fixture sic_mosfet_double_pulse_fixture
• Sheet Resistance: A Guide to Theory
• Wafer flatness measurements
• Definition of Weibull Plot

• C‑V Characterization of MOS Capacitors Using the 4200A-SCS Parameter Analyzer

RF characterization

• S parameters S21 & S11 measurements using a Vector Network Analyzer (VNA)

Wafer Fabrication

• Design Example: Wolfspeed GaN PDK for 140nm 40 GHz MMIC (2016)

• Design Solutions in Foundry Environment (2004, including description of PDK)
• Fabrication of Semiconductor Devices （MIT）
• CMOS Inverter layout (UC Berkeley Lecture notes)
• Manufacturing Process Monitoring by Cpk
• How to construct a wafer fabrication factory

Reliability

• Gate oxide reliability — a review
• Power semiconductor reliability-handbook (Alpha Omega 2010)
• The Types of Semiconductor Reliability and Quality Testing (such as intermittent operating life test IOL)
• AEC-Q-101 Parameters to be tested