Packaging and Modules
Packaging
Basic Knowledge
- Power Electronic Packaging Substrate (Wiki)
- SiC Power Module (Sandia National Lab, 2009)
- Packaging Technologies for SiC Power Modules (2012, Fuji Electric)
- High Temperature Packaging of 50 kW Three-Phase SiC Power Module (~ 2011)
- Inverter sub-modules construction
- Die attachment materials review for high temperature applications 2011
- Power Packaging Review
- WBG Inverter Packaging (Oak Ridge National Lab 2013)
- Market & Technology trends in Wide BandGap power packaging (Yole 2015)
- Thermal performance evaluation of SiC power devices packaging （2013）
- Substrate materials (1700V and above: AlSiC, 1200V and 1700V: Cu, Infineon)
- Analysis on partial thermal resistances of packaged SiC schottky barrier diodes at elevated temperatures (Osaka Univ. 2016)
- flip-chip packaging under bump metallization steps
- 3D packaging (GeorgiaTech 2018)
SiC Packaging
-
Silicon Carbide: Driving Package Innovation (Compound Semiconductors, 2018.10)
- High Performance Silicon Carbide Power Packaging, review 2017, energies-10-00341.
Packaging and Module Companies
| Company | Main Products | HQs | Remarks |
|---|---|---|---|
| Fuji Electric | |||
| Mitsubishi Electric | |||
| semikron | |||
| CISSOID | high voltage gate drivers for SiC & GaN transistors, Power Modules | BELGIUM | |
Packaging Companies
UBM (under bump metal) foundry :
- Flipchip International
- JX Introduction JXIntroduction UBM 2018UBM Cu paste for packaging M_CuPaste
- European Power Electronics Lab: Aalborg University, Denmark
- SemiKron AG
Power Modules (e.g., for charging stations)
-
SiC MOSFET-Based Power Module Design and Analysis for EV Traction Systems (2018, Oak Ridge National Laboratory)